Electronic Potting

Paladin offers epoxy curing agents, and reactive and non-reactive epoxy diluents suitable for use in electronics adhesives and potting.
LOW VISCOSITY AND HYDROPHOBICITY

Paladin offers reactive and non-reactive epoxy diluent based on cardanol technology with low chlorine content. The unique chemical structure of cardanol provides excellent water resistance with good flexibility to ensure proper protection and service of electronic components.

Paladin products with good thermal shock, mechanical and chemical resistance coupled with good adhesion to various metals, allows for good performance in electronics adhesives and potting materials.

Also our phenalkamine and phenalkamide are good alternative for two-component epoxy systems in electronics assembly processes looking for a balance of cure and handling properties.